IEC 61189-2:2006 PDF (Not Available)

The IEC 61189-2:2006 standard is a comprehensive document that outlines various test methods used for evaluating the materials used in the production of interconnection structures, such as printed circuit boards.

The standard serves as a guidebook for manufacturers and testing laboratories, providing a catalogue of methodologies and procedures for conducting tests on these materials. By following the guidelines set forth in this standard, manufacturers can ensure the quality and reliability of their interconnection structures and assemblies.

The test methods outlined in the standard cover various aspects of material evaluation, including mechanical, electrical, thermal, and chemical properties. These tests help assess the suitability of materials for their intended applications, and they enable manufacturers to make informed decisions during the production process.