IPC SM-840E:2010 PDF Download

IPC SM-840E:2010 is a standard that establishes the requirements for the evaluation and acceptance of both liquid and dry film solder mask materials for use on standard printed circuit boards. The standard provides two classes of requirements, T and H, which reflect different levels of functional performance and testing severity based on industry and end-use requirements.

The standard covers various aspects of solder mask materials, including adhesion, material qualification, resistance to solvents, and electrical requirements. It also includes requirements for flexible cover materials used as a protective layer over etched conductors and other conductive features.

This standard, with its comprehensive guidelines and classifications, ensures that solder mask materials meet the necessary performance criteria and can be reliably used in a variety of applications in the electronics industry. It helps manufacturers and users of solder mask materials to select and qualify the appropriate materials for their specific needs, thereby ensuring the quality and reliability of printed circuit boards.