IPC IPC J-STD-035:1999

IPC J-STD-035:1999 PDF Download

Standard EN Sample
IPC J-STD-035:1999 Sample

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

Also Known As: IPC/JEDEC J-STD-035

SKU198533420 Published by IPC International Inc, formerly Institute for Printed Circuits IPC Publication Date1999-04-01 Pages CountPages20

The IPC J-STD-035:1999 standard outlines the procedures for conducting acoustic microscopy on electronic components that are encapsulated in non-hermetic packaging. The objective of this standard is to provide users with a reliable and reproducible method for detecting defects in plastic packages without causing damage.

Acoustic microscopy is a non-destructive testing technique that uses ultrasound waves to image and analyze the internal structure of materials. By using this method, manufacturers and quality control teams can identify potential defects or anomalies within the package, such as voids, delaminations, or cracks. This allows for early detection of potential reliability issues and aids in the assessment of package quality.

The standard provides a comprehensive process flow for conducting acoustic microscopy, ensuring consistent and reliable results.

Details
Language(s)English
File Size337.9 KB
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