JIS C 60068-2-69:2019 PDF Download

JIS C 60068-2-69:2019 is a standard that specifies the testing procedures for solderability of electronic components and printed boards using the wetting balance (force measurement) method. It includes two types of tests: test Te, which is the solderability testing of printed boards, and test Tc, which is the solderability testing of electronic components using quantitative assessment criteria such as wetting time and wettability.

The standard emphasizes that the data obtained from these tests should not be used as pass-fail criteria. Instead, they serve as a quantitative measurement of solderability. The procedures described in the standard include the use of solder bath wetting balance method and solder globule wetting balance method.

These methods are applicable to components and printed boards with metallic terminations and metallized solder pads. The standard also covers solder alloys with and without lead (Pb).

It is important to note that there is an international standard corresponding to JIS C 60068-2-69:2019, which is IEC 60068-2-69:2017. This indicates that the JIS standard aligns with the international standard and the degree of correspondence between the two.