IPC 1602:2020 PDF Download
Standard EN Sample
Standard for Printed Board Handling and Storage
Also Known As:
The IPC-1602:2020 standard aims to establish guidelines for the proper handling, storage, and transportation of printed boards. By adhering to this standard, manufacturers can prevent contamination, physical damage, degradation of solderability, and moisture uptake in printed boards.
The standard takes into account various factors such as the types of packaging materials used, the production environment, the methods of handling and transporting the product, and the establishment of baking profiles for moisture removal. It also allows these requirements to be included in procurement documentation, ensuring that suppliers and manufacturers are aware of the specifications they need to meet.
Some key areas covered by IPC-1602 include the use of moisture barrier bags (MBBs), the impact of baking on the solderability of printed boards, electrostatic discharge (ESD) considerations, moisture concerns for etched cores and composites, the use of desiccant materials and humidity indicator cards (HIC cards), as well as examples of how packaging and handling requirements can be implemented.
| ICS Codes | 31.240 - Mechanical structures for electronic equipment |
| Language(s) | English |
| ISBN | 978-1-951577-19-3 |
| File Size | 4.8 MB |
