IPC 1601A:2016 PDF Download

The IPC 1601A:2016 standard is a comprehensive guideline for the handling, packaging, and storage of printed boards in the electronics industry. The purpose of this standard is to ensure that printed boards are protected from various potential risks, such as contamination, physical damage, solderability degradation, and moisture uptake.

The standard covers a wide range of aspects related to the handling and storage of printed boards. It provides guidance on selecting appropriate packaging materials and methods, considering factors such as the production environment, handling and transportation of the products. It also emphasizes the importance of establishing baking profiles for moisture removal.

Revision A of the standard introduces additional information and coverage on certain aspects. It expands on the use of moisture barrier bags (MBBs), the impact of baking on the solderability of printed boards, electrostatic discharge (ESD) issues, concerns related to moisture in etched cores and composites, and the use of desiccant materials and HIC cards. Additionally, the revision includes example flowdowns of packaging and handling requirements.