JIS C 60068-2-69:2009 PDF Download
Standard EN Sample
Environmental Testing - Part 2-69: Tests - Test Te: Solderability Testing of Electronic Components for Surface Mounting Devices (SMD) by the Wetting Balance Method
Also Known As:
The JIS C 60068-2-69:2009 standard provides a set of procedures for evaluating the solderability of terminations on surface mounting devices. The standard includes two methods for determining solderability: the solder bath wetting balance method and the solder globule wetting balance method.
These methods are applicable to components with metallic terminations and metallized solder pads. The standard specifies procedures for both solder alloys containing lead (Pb) and lead-free solder alloys. It also mentions that if applicable, JIS C 60068-2-54 should be consulted for additional guidelines on surface mounting devices.
The standard indicates that it is in accordance with the International Electrotechnical Commission (IEC) standard IEC 60068-2-69:2007, which has the same title and provides the same test method for solderability testing of electronic components for surface mounting devices using the wetting balance method.
| ICS Codes | 19.040 - Environmental testing 31.190 - Electronic component assemblies |
| Language(s) | English |
| File Size | 1.1 MB |
