Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
Also Known As:
SKU175915449
Published by
IPC International Inc, formerly Institute for Printed Circuits
IPC
Publication Date2019-06-01
Pages CountPages208
The IPC 7095D-WAM1:2019 standard focuses on providing guidance for the design and assembly implementation of BGAs and fine-pitch BGAs. It is specifically aimed at addressing inspection, repair, and reliability issues that are associated with the design and assembly of printed boards using these types of packages.
The standard aims to provide practical and useful information to individuals who currently use or are considering using BGAs. It offers detailed descriptions on how to successfully implement robust design and assembly processes for printed board assemblies that incorporate BGAs. Additionally, it offers troubleshooting guidelines to address common anomalies that may occur during BGA assembly.
Details
| ICS Codes | 31.080 - Semiconductor devices |
| Language(s) | English |
| ISBN | 978-1-61193-486-1 |
| File Size | 16.6 MB |
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Right after completing the purchase process, you will immediately get a digital copy of this standard which is:
Not Locked
Printable
Multi-User
$
41.00
